Zentrum für angewandte Forschung
Institut für Präzisionsbearbeitung und Hochfrequenztechnik - Technologie Campus Teisnach
Projektmitarbeiter
Analysis of Inkjet-Printed Interdigital Capacitors on Low-Cost PCB Substrates up to 40 GHz Compared to Other Estabilished Manufacturing Technologies . [Accepted for publication]
An Effective Surface Impedance Concept to Model Arbitrary Roughness Profiles on Printed Circuit Boards up to 110 GHz . [Accepted for publication]
Characterization of Additively Produced RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology for Industrial Applications up to 80 GHz
In: IEEE Transactions on Components, Packaging and Manufacturing Technology vol. 11 pg. 1-11.
DOI: 10.1109/TCPMT.2021.3118720
Comparison of an Inkjet Fabrication Method on Low-Cost PCB Substrates With Semi Additive And Subtractive Technologies Regarding RF-Performance
pg. 266-268.
DOI: 10.1109/IMWS-AMP53428.2021.9643887
Reliability Investigations of Additive Manufactured RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology
DOI: 10.23919/EuMC50147.2022.9784224
Bare die connections via aerosol jet technology for millimeter wave applications
In: International Journal of Microwave and Wireless Technologies vol. 11 pg. 441-446.
DOI: 10.1017/S1759078719000114
Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) . Abschlussbericht
Technische Hochschule Deggendorf (THD)/Technologie Campus Teisnach
WR12 to planar transmission line transition on organic substrate
DOI: 10.23919/EuMC.2019.8910843
WR12 to planar transmission line transition on organic substrate . Invited Talk
In: 49th European Microwave Conference (EuMC)
Paris, Frankreich
Rechnergestützte Optimierung von galvanischen Kupferabscheideprozessen . Posterpräsentation
In: 5. Tag der Forschung
Technische Hochschule Deggendorf Deggendorf
Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications
Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications
DOI: 10.23919/EuMC.2017.8230878
Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) . Projektbericht
Technische Hochschule Deggendorf/Technologie Campus Teisnach
Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages . An effort to design an all-purpose RF chip package
pg. 536-539.
Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages . An effort to design an all-purpose RF chip package
pg. 1465-1468.
Wideband RF interconnects for organic chip packages comparison of single ended and differential transitions . An effort to design an all-purpose RF chip package
pg. 781-784.
Embedded Resistors for High Frequency Applications on Printed Circuit Boards