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Dipl.-Ing. (FH) Johannes Jakob, M.Eng.

Zentrum für angewandte Forschung

Institut für Präzisionsbearbeitung und Hochfrequenztechnik - Technologie Campus Teisnach

Projektmitarbeiter

T 107

09923/80108-422

Sortierung:
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • M. Schmalzbauer
  • T. Wagner
  • Johannes Jakob
  • Andreas Scharl
  • A. Kasbauer
  • Raimund Förg
  • Werner Bogner
  • Stefan Zorn

Analysis of Inkjet-Printed Interdigital Capacitors on Low-Cost PCB Substrates up to 40 GHz Compared to Other Estabilished Manufacturing Technologies . [Accepted for publication]

  • (2023)
  • TC Teisnach Sensorik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • Andreas Scharl
  • Johannes Jakob
  • M. Schmalzbauer
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

An Effective Surface Impedance Concept to Model Arbitrary Roughness Profiles on Printed Circuit Boards up to 110 GHz . [Accepted for publication]

  • (2023)
  • TC Teisnach Sensorik
  • DIGITAL
Zeitschriftenartikel

  • Felix Sepaintner
  • M. Schmalzbauer
  • K. Lobbicke
  • Johannes Jakob
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Roman Sammer
  • Werner Bogner
  • Stefan Zorn

Characterization of Additively Produced RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology for Industrial Applications up to 80 GHz

In: IEEE Transactions on Components, Packaging and Manufacturing Technology vol. 11 pg. 1-11.

  • (2021)

DOI: 10.1109/TCPMT.2021.3118720

Usually, the printed circuit board industry has to use special subtractive manufacturing methods, if small line and space dimensions down to 50 μm are desired. This drastically raises production effort and costs. In this paper a method is shown, how the inkjet technology can be used to produce passive RF structures with minimum line and space dimensions of 25 μm. For the first time, this is possible over complete panels of low-cost PCB substrates, which have a relatively high surface roughness compared to ceramic or glass carriers. To ensure process reliability, printed lines must also be plated with an additional electroless copper layer to overcome the surface roughness with conductive layers and to lower insertion loss in the two-digit GHz range. Additionally, a surface impedance model is developed, which allows broadband first time right simulations. Finally, additively produced, passive RF filters are compared to their subtractive counterparts to show their benefits regarding production costs and electrical performance up to 80 GHz.
  • TC Teisnach Optik
  • Elektrotechnik und Medientechnik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • M. Schmalzbauer
  • Johannes Jakob
  • Andreas Scharl
  • G. Weber
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Comparison of an Inkjet Fabrication Method on Low-Cost PCB Substrates With Semi Additive And Subtractive Technologies Regarding RF-Performance

pg. 266-268.

IEEE

  • (2021)

DOI: 10.1109/IMWS-AMP53428.2021.9643887

  • TC Teisnach Optik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • M. Schmalzbauer
  • Johannes Jakob
  • Andreas Scharl
  • Felix Sepaintner
  • K. Löbbicke
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Reliability Investigations of Additive Manufactured RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology

  • (2021)

DOI: 10.23919/EuMC50147.2022.9784224

In this paper a reliability study of additively manufactured RF structures on printed circuit boards (PCB) based on inkjet technology is presented. First, the main focus is placed on the development of a suitable PCB test layout which contains microstrip lines, RF filters and ball grid array (BGA) structures. In order to ensure a good comparability with the standard subtractive technology, additive and standard manufactured structures are placed side by side. During our analysis both thermal and mechanical reliability tests were conducted. Possible changes in electrical properties were determined by subsequent RF measurements at multiple readouts. To our knowledge, for the first time an equivalent RF performance of additive and subtractive manufactured structures after stress tests up to 40 GHz was observed. Additionally, the compatibility of the additively manufactured structures with standard assembly processes are examined. Therefore, bond and solder tests are performed. Finally, an extensive assessment of all robustness tests is carried out and a recommendation about a future applicability in series products is given.
  • TC Teisnach Optik
  • Elektrotechnik und Medientechnik
  • DIGITAL
Zeitschriftenartikel

  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • R. Weigel
  • Stefan Zorn

Bare die connections via aerosol jet technology for millimeter wave applications

In: International Journal of Microwave and Wireless Technologies vol. 11 pg. 441-446.

  • (2019)

DOI: 10.1017/S1759078719000114

This paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Bericht/Report

  • Franz Xaver Röhrl
  • Siegfried Hildebrand
  • Johannes Jakob
  • Stefan Zorn
  • Werner Bogner

Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) . Abschlussbericht

Technische Hochschule Deggendorf (THD)/Technologie Campus Teisnach

  • 2019 (2019)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Johannes Jakob
  • R. Sammer
  • Franz Xaver Röhrl
  • Stefan Zorn
  • Werner Bogner

WR12 to planar transmission line transition on organic substrate

  • (2019)

DOI: 10.23919/EuMC.2019.8910843

Transitions for planar transmission lines on printed circuit boards to rectangular waveguide are challenging to design and manufacture. This paper introduces two transitions, the first one is a broadband transition from WR12 (60-90 GHz) waveguide to a stripline (SL) and the second is a narrowband transition to a grounded coplanar waveguide (GCPW). The focus at the first transition is based on the fact that signals can be transmitted in the complete E-Band. In the process, many manufacturing possibilities were exploited. For the second transition, the focus was on manufacturability in order to achieve the most cost effective transition possible. Design, simulated and measured results will be presented.
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Vortrag

  • Johannes Jakob
  • R. Sammer
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

WR12 to planar transmission line transition on organic substrate . Invited Talk

Paris, Frankreich

  • 29.09.-04.10.2019 (2019)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Vortrag

  • Johannes Jakob

Rechnergestützte Optimierung von galvanischen Kupferabscheideprozessen . Posterpräsentation

Technische Hochschule Deggendorf Deggendorf

  • 08.03.2018 (2018)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
Beitrag in Sammelwerk/Tagungsband

  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • R. Weigel
  • Stefan Zorn

Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications

  • (2018)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Franz Xaver Röhrl
  • Roman Sammer
  • Johannes Jakob
  • Werner Bogner
  • R. Weigel
  • U. Hassel
  • Stefan Zorn

Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications

  • (2017)

DOI: 10.23919/EuMC.2017.8230878

  • TC Teisnach Optik
  • Elektrotechnik und Medientechnik
  • DIGITAL
Bericht/Report

  • Franz Xaver Röhrl
  • Siegfried Hildebrand
  • Johannes Jakob
  • Stefan Zorn
  • Werner Bogner

Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) . Projektbericht

Technische Hochschule Deggendorf/Technologie Campus Teisnach

  • 2017 (2017)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • D. Hageneder
  • Stefan Zorn

Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages . An effort to design an all-purpose RF chip package

pg. 536-539.

  • (2016)
  • TC Teisnach Optik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • D. Hageneder
  • Stefan Zorn

Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages . An effort to design an all-purpose RF chip package

pg. 1465-1468.

  • (2016)
  • TC Teisnach Optik
  • Elektrotechnik und Medientechnik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • D. Hageneder

Wideband RF interconnects for organic chip packages comparison of single ended and differential transitions . An effort to design an all-purpose RF chip package

pg. 781-784.

  • (2015)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • A. Bauer
  • Johannes Jakob
  • R. Gmiha
  • D. Hageneder
  • Werner Bogner

Embedded Resistors for High Frequency Applications on Printed Circuit Boards

  • (2013)
  • Elektrotechnik und Medientechnik