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DIT Research

Pioneering & Vibrant

Institute for Quality & Material analysis.

R & D projects and services in the fields of analytics and quality assurance (QA) with a focus on materials and components of electronics (e.g. printed circuit boards), thin films, surfaces as well as micro- and nanostructures.


Topics:

Analytics: Micro-, nano- and surface analysis, scanning probe microscopy, scanning electron microscopy & STEM, microstructure and structure analysis (EBSD), X-ray analysis (EDX, WDX), micro X-ray fluorescence (μ-XRF), wavelength dispersive X-ray fluorescence, FT-Infrared spectroscopy, , sample preparation & ion beam treatment, combined mechanical, magnetic, electrical, thermal and chemical micro-characterization, macroscopic thermal characterization, thin film analysis, coordinate metrology

QS: IC quality assurance and reliability analysis, semiconductor wafer level tests (up to 300mm wafers), development and implementation of IC stress and test procedures, lifetime projections, fault and failure analysis, semiconductor measurement technology, lock-in amplifier measurement technology

  •     Micro-, nano- and surface analytics
  •     Scanning probe microscopy (AFM), topography
  •     Determination of electrical conductivities (CAFM),
  •     surface potentials (KPFM), mechanical properties (QNM),
  •     Dopant distributions or profiles (SCM)
  •     Scanning Electron Microscopy (SEM) & STEM, Microstructure- and
  •     Structure analysis (EBSD), energy and wavelength dispersive
  •     X-ray analysis (EDX, WDX), micro X-ray fluorescence (μ-XRF)
  •     FT-Infrared Spectroscopy (FTIR)
  •     Metallographic preparation, embedding, finishing,
  •     Ion beam treatment, surface modifications
  •     Combined mechanical, magnetic, electrical, thermal and
  •     chemical micro-characterization
  •     thin-film analytics
  •     Coordinates metrology
  •     Lock-In Amplifier Measurement Technology
  •     Macroscopic thermal characterization (3-omega methodology)

 

  • Quality Assurance and Reliability Analysis for Integrated
  • Circuits (IC), semiconductor wafer level tests (up to 300mm wafers),
  • Development and implementation of IC stress and test procedures,
  • Lifetime projections, fault and failure analysis,
  • semiconductor metrology

 

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