The Technology Campus Teisnach Sensor Technology is a research institution of the Deggendorf Institute of Technology (DIT) and bundles the know-how of DIT in the following areas:
For small and medium-sized companies it is sometimes very difficult to test new product ideas in the field of sensor technology. For example, there is usually a lack of specialised equipment for the deposition of special layers, or the development of an assembly and connection technology must be purchased externally, which usually only pays off for higher quantities. Furthermore, the secure integration of sensors plays a decisive role in the digitalisation strategy of companies.
Against this background, the idea for a new Technology Campus of the Deggendorf Institute of Technology was born to take on this challenge. In January 2018, for example, the NEPROMUK project (Network Centre Industry 4.0 modern production, measurement and communication technologies for industry and trade) - a joint project of the market town of Teisnach and the Deggendorf Institute of Technology - will launch the Technology Transfer Centre Teisnach II under the name Technology Campus Teisnach Sensor Technology (TCTS).
Our vision is the expansion of the competitiveness of local companies through technology transfer. As a network node in the fields of integrated optics, application and safe integration of sensors in existing productions and new material development in the field of sensor technology, we support our partners in digital transformation.
Three research groups are currently based at the TCTS, which focus on the following areas:
Industrial sensor technology is now finding its ways into more and more technical and commercial systems. Due to the large number of possible applications, there is a growing demand for systems adapted to the application. The activities at the TC Teisnach Sensor Technology include the design of micro-optical components and systems, the production of integrated optic by ion exchange in glass, simulation of the underlying physical processes, optical simulation, optical assembly and interconnection technology, testing and characterisation of optical components. This is combined with sensor technology based on surface acoustic waves, for example for the characterisation of material properties.
However, especially in the field of development or special applications (high temperatures, harsh environments), such systems are hardly or only with difficulty available. With out competence and equipment in micromachining, we offer innovative and application-oriented solutions in the field of packaging for sensors as part of research projects or services, starting from quantity 1.
The processing spectrum ranges from plastics and non-ferrous metals to hardened steels, hard metals, technical ceramics and glasses.
In addition, further facilities are available for the construction of jigs and fixtures and test setups, enabling an efficient workflow with short distances and fast reaction times.
Our team of physicists and engineers develops novel components in glass. The focus here is on light-conducting components in the micrometer range, which can be directly coupled to fibre optic cables and deliver particularly high optical quality. Current topics are, for example, sensor technology for depth-resolved material characterisation, for condition monitoring of buildings, as well as datacom applications.
We design and implement micro-optical components and systems for these applications. Among other things, we use ion exchange processes to specifically increase the refractive index in glass. All steps starting with preliminary studies, design, production and validation are supported by simulations. Thus, optical distribution components with extremely low signal losses as well as miniaturised sensor applications become possible.
In addition to the process steps for manufacturing, the characterisation is also of essential importance. Here we rely on our expertise in the construction and operation of optical measuring instruments. For example, we use a self-developed RNF measuring device to determine refractive index profiles. The control as well as the interface was programmed by us in Python.
Furthermore, we have the possibility to print prototypes in 3D, polish surfaces and finely process optics with our 5-axis ultra-short plus laser.
Due to our high-tech equipment and our competence in simulation, theory and experience we are well prepared for all challenges in the field of micro-optics and look forward to hearing from you.
A suitabke digitalisation strategy is indispensable for the future competitiveness of industrial companies. This includes intelligent machines and sensors, suitable procedures for data evaluation, e.g. with machine learning methods, and the safeguarding of communication links between the components involved in production. Due to the increasing networking of heterogeneous components in the course of digitalisation, ever higher demands are placed on availability, integrity and plant safety.
The ProtectIT institute at TC Teisnach Sensor Technology is developing solutions for secure digitalisation in research and service projects. This includes
In addition to our own know-how, the existing structures on campus are available for this purpose (laboratories and test setups, servers, IT infrastructure).
The core of the research is the development of secure communication architectures for modern automation environments using standardised protocols (e.g. OPC UA). For this purpose, besides classical encryption methods, machine learning methods are increasingly used to realise intelligent plant monitoring by analysing the interface between sensors and other systems.
The Technology Campus Teisnach cooperates regionally with partners from industry and education. In addition, there are numerous cooperation partners in our research projects of the individual working groups.
Technische Hochschule Deggendorf
Technologie Campus Teisnach
Institut für Präzisionsbearbeitung und Hochfrequenztechnik
Technologiecampus 1 & 3
+49 (0)9923 - 80108 - 400
+49 (0)9923 - 80108 - 421