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Felix Sepaintner, M.Sc

Zentrum für angewandte Forschung

Technologie Campus Teisnach - Optik

Mitarbeiter

T 107

09923/80108-434

Sortierung:
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • M. Schmalzbauer
  • T. Wagner
  • Johannes Jakob
  • Andreas Scharl
  • A. Kasbauer
  • Raimund Förg
  • Werner Bogner
  • Stefan Zorn

Analysis of Inkjet-Printed Interdigital Capacitors on Low-Cost PCB Substrates up to 40 GHz Compared to Other Estabilished Manufacturing Technologies . [Accepted for publication]

  • (2023)
  • TC Teisnach Sensorik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • Andreas Scharl
  • Johannes Jakob
  • M. Schmalzbauer
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

An Effective Surface Impedance Concept to Model Arbitrary Roughness Profiles on Printed Circuit Boards up to 110 GHz . [Accepted for publication]

  • (2023)
  • TC Teisnach Sensorik
  • DIGITAL
Zeitschriftenartikel

  • Felix Sepaintner
  • M. Schmalzbauer
  • K. Lobbicke
  • Johannes Jakob
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Roman Sammer
  • Werner Bogner
  • Stefan Zorn

Characterization of Additively Produced RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology for Industrial Applications up to 80 GHz

In: IEEE Transactions on Components, Packaging and Manufacturing Technology vol. 11 pg. 1-11.

  • (2021)

DOI: 10.1109/TCPMT.2021.3118720

Usually, the printed circuit board industry has to use special subtractive manufacturing methods, if small line and space dimensions down to 50 μm are desired. This drastically raises production effort and costs. In this paper a method is shown, how the inkjet technology can be used to produce passive RF structures with minimum line and space dimensions of 25 μm. For the first time, this is possible over complete panels of low-cost PCB substrates, which have a relatively high surface roughness compared to ceramic or glass carriers. To ensure process reliability, printed lines must also be plated with an additional electroless copper layer to overcome the surface roughness with conductive layers and to lower insertion loss in the two-digit GHz range. Additionally, a surface impedance model is developed, which allows broadband first time right simulations. Finally, additively produced, passive RF filters are compared to their subtractive counterparts to show their benefits regarding production costs and electrical performance up to 80 GHz.
  • TC Teisnach Optik
  • Elektrotechnik und Medientechnik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Andreas Scharl
  • Felix Sepaintner
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

A Cost-Effective Method for Extracting the Complex Permittivity of Inner Layer Dielectric PCB Materials

  • (2021)

DOI: 10.23919/EuMC50147.2022.9784297

This paper presents a new cost-effective method to deduce the dielectric properties of substrate materials, which are used in inner layers of low cost printed circuit boards (PCBs). Two different on board structures are applied to estimate the desired complex permittivity in two different ways. On the one hand, a T-resonator based on substrate integrated waveguide technology (SIW) is used, on the other hand a stripline, whereby both are a combination of the outer layer laminate and the underlying prepreg. At first, the scattering parameters of both dielectric structures are measured with a vector network analyzer (VNA). The structures are then simulated with the finite integral method (FI) with all dielectric materials substituted by air. Afterwards, a second simulation with the dielectric constant (DK) of the known dielectric material is necessary. Next, the real part of the complex permittivity is calculated. Finally, the dissipation factor (DF) is calculated.
  • TC Teisnach Optik
  • Elektrotechnik und Medientechnik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • M. Schmalzbauer
  • Johannes Jakob
  • Andreas Scharl
  • G. Weber
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Comparison of an Inkjet Fabrication Method on Low-Cost PCB Substrates With Semi Additive And Subtractive Technologies Regarding RF-Performance

pg. 266-268.

IEEE

  • (2021)

DOI: 10.1109/IMWS-AMP53428.2021.9643887

  • TC Teisnach Optik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • M. Schmalzbauer
  • Johannes Jakob
  • Andreas Scharl
  • Felix Sepaintner
  • K. Löbbicke
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Reliability Investigations of Additive Manufactured RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology

  • (2021)

DOI: 10.23919/EuMC50147.2022.9784224

In this paper a reliability study of additively manufactured RF structures on printed circuit boards (PCB) based on inkjet technology is presented. First, the main focus is placed on the development of a suitable PCB test layout which contains microstrip lines, RF filters and ball grid array (BGA) structures. In order to ensure a good comparability with the standard subtractive technology, additive and standard manufactured structures are placed side by side. During our analysis both thermal and mechanical reliability tests were conducted. Possible changes in electrical properties were determined by subsequent RF measurements at multiple readouts. To our knowledge, for the first time an equivalent RF performance of additive and subtractive manufactured structures after stress tests up to 40 GHz was observed. Additionally, the compatibility of the additively manufactured structures with standard assembly processes are examined. Therefore, bond and solder tests are performed. Finally, an extensive assessment of all robustness tests is carried out and a recommendation about a future applicability in series products is given.
  • TC Teisnach Optik
  • Elektrotechnik und Medientechnik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Andreas Scharl
  • Felix Sepaintner
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz . [Invited Talk]

  • (2020)

In this paper, 4 different crossover structures in a 6-layered printed circuit board (PCB) for high operation frequencies are presented. The design for all structures is based on grounded coplanar waveguide (GCPW). Two fully planar structures, a quasi-coaxial transition and coaxial transition are realized and have a measured bandwidth from DC to 50 GHz and DC to 60 GHz, respectively. Moreover, two structures are designed in submount technology. Especially the connection between baseboard and package (solder junction) plays an important role to guarantee best signal integrity. Therefore, the quality of the solder junction is analysed in detail with TDR (time domain reflectometry) measurement as well as with X-ray images. The submount transitions show good radio frequency (RF) characteristics from DC to 70 GHz.
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Vortrag

  • Andreas Scharl
  • Felix Sepaintner
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz . Invited Talk

Cottbus

  • 09.03.2020 (2020)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • NACHHALTIG
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz . [Invited Talk]

  • (2020)

DOI: 10.1109/IMWS-AMP49156.2020.9199738

This paper presents a new numerical method to deduce the complex permittivity εr of PCB (printed circuit board) substrates. First, the attenuation and phase of an on board transmission line are measured with a vector network analyzer (VNA). The transmission line is then simulated with the finite difference integral method (FDI) with the substrate substituted by air. The measured and simulated phases are used, to calculate the effective permittivity and the real part of the complex permittivity εr ' . With known εr ' , the electromagnetic field distribution can be calculated, which is necessary to deduce the imaginary part of the permittivity. The shown algorithms can be used for frequencies up to 100 GHz and without any iterative processes.
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Andreas Scharl
  • Felix Sepaintner
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Design and Comparison of Filter Structures in the Millimetre Wave Frequency Range on Outer- and Inner-Layers of Organic Circuits Boards . [Invited Talk]

  • (2020)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Zeitschriftenartikel

  • Felix Sepaintner
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Characterization and Production of PCB Structures With Increased Ratio of Electromagnetic Field in Air

In: IEEE Transactions on Microwave Theory and Techniques vol. 68 pg. 2134-2143.

  • (2020)

DOI: 10.1109/TMTT.2020.2983934

Producing passive printed circuit board (PCB) structures in the millimeter-wave range includes some fundamental challenges, such as low manufacturing costs and high fabrication accuracy. These aspects, in general, have to be combined with low signal attenuation, precise simulation models, and a reliable producibility. This article shows a new method to manufacture different kinds of passive RF waveguides with reduced attenuation and decreased electrical length on low-cost PCB substrates. First, the complex material parameters of the used substrate and the used copper foil are extracted from 10 to 100 GHz to have accurate simulation models in CST Microwave Studio. This is necessary because the parameters provided by the manufacturer are often no longer generally valid in this frequency range. In addition, PCB materials have a significantly higher surface roughness compared with conventional materials for millimeter-wave applications. Therefore, the correct determination and the correct modeling of surface roughness is particularly important. Next, laminate is removed partially on the outer layer of the PCB to increase the electromagnetic field ratio in air. The undesired substrate is removed by a CO2 laser drilling machine by setting narrow drills sequentially. The RF performance of these waveguides is compared with those manufactured in conventional PCB technology according to attenuation and producibility.
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Vortrag

  • Andreas Scharl
  • Felix Sepaintner
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Design and Comparison of Filter Structures in the Millimetre Wave Frequency Range on Outer- and Inner-Layers of Organic Circuits Boards

Institute of Electrical and Electronics Engineers Inc. Utrecht, The Netherlands

  • 15.09.2020 (2020)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • NACHHALTIG
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • Andreas Scharl
  • Florian Keck
  • Kevin Kunze
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards . [Invited Talk]

  • (2020)

DOI: 10.1109/EPEPS48591.2020.9231382

This paper presents a new cost-effective method to produce air-filled waveguides out of a printed circuit board (PCB) with a milling machine and how to implement them with standard PCB technology. For this purpose, low cost substrates like FR-4 are used. For the baseboard to waveguide transition in the E-Band (60-90GHz) a WR12 waveguide connector [1] was used. The WR12 waveguide was manufactured and analyzed on mechanical deviations. The RF performance in the E-Band was measured and compared to common PCB waveguides like microstrip lines (MS) and grounded coplanar waveguides (GCPW).
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Vortrag

  • Felix Sepaintner
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz . Invited Talk

Institute of Electrical and Electronics Engineers Inc. Suzhou, China

  • 29.07.2020 (2020)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • NACHHALTIG
  • DIGITAL
Vortrag

  • Felix Sepaintner
  • Andreas Scharl
  • Florian Keck
  • Kevin Kunze
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards . Invited Talk

Institute of Electrical and Electronics Engineers Inc. San José, CA, USA

  • 05.10.2020 (2020)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • NACHHALTIG
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air

  • (2019)

DOI: 10.1109/IMWS-AMP.2019.8880079

This paper presents a new method to produce different kinds of RF waveguides with reduced attenuation on low cost PCB substrates. First, microstrip (MS) and grounded coplanar waveguides (GCPW) are characterized by considering rough conductors in CST Microwave Studio. Next, laminate is partially removed, to increase the electromagnetic field ratio in air. Accordingly, the dielectric losses are reduced and the electrical length is decreased. These conductors are produced by using a CO 2 laserdrilling machine to remove the undesired substrate. The RF performance (DC to 100 GHz) of these waveguides is compared to transmission lines manufactured in conventional PCB technology. Finally, different kinds of simulated and produced microstrip filters are shown and fabrication tolerances are compared to those produced in standard technology.
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Vortrag

  • Felix Sepaintner
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air . Invited Talk

Bochum

  • 16.-18.07.2019 (2019)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL