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Prof. Dr.-Ing. Stefan Zorn

Hochfrequenztechnik Elektrische Messtechnik Leiterplattentechnologie

Fakultät Elektrotechnik und Medientechnik

Professorinnen und Professoren

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Beitrag in Sammelwerk/Tagungsband
  • Stefan Zorn
  • H. Ehm
  • R. Weigel

A Novel Technique for Determining Kernels of Volterra Based Behavioral Models for RF Amplifiers.

London: Horizon House Publications pg. 246-249

DOI: 10.1109/EUMC.2008.4751434

(2008)

Vortrag
  • Stefan Zorn

Localization for Search and Rescue Applications. Workshop.

San Diego, CA, USA 18.-22.01.2009.

(2009)

Vortrag
  • Stefan Zorn

Localization for Search and Rescue Applications. Workshop.

Ulm Juni 2009.

(2009)

Vortrag
  • A. Goetz
  • R. Rose
  • Stefan Zorn
  • R. Weigel

Ortung von GSM-Mobiltelefonen in Katastrophenszenarien.

Berlin 09.-10.07.2009.

(2009)

Vortrag
  • A. Goetz
  • Stefan Zorn
  • R. Rose
  • R. Weigel

Ortung von GSM-Mobiltelefonen in Katastrophenszenarien.

  • Swiss Institute of Navigation.

Zürich, Schweiz 05.-06.11.2009.

(2009)

Vortrag
  • R. Rose
  • Stefan Zorn
  • A. Goetz
  • R. Weigel

Ortung verschütteter Personen anhand ihrer GSM-Mobiltelefone.

Berlin 18.11.2009.

(2009)

Vortrag
  • Stefan Zorn

A Novel Technique for Mobile Phone Localization for Search and Rescue Applications.

Ilmenau 2010.

(2010)

Beitrag in Sammelwerk/Tagungsband
  • Stefan Zorn
  • R. Rose
  • A. Goetz
  • R. Weigel

A novel technique for mobile phone localization for search and rescue applications.

  • In:
  • M. Kunz
  • R. Mautz
  • H. Ingensand

[Piscataway, N.J.]: IEEE pg. 1-4

DOI: 10.1109/IPIN.2010.5647107

(2010)

Vortrag
  • Stefan Zorn

A new Approach on Mobile Phone Localization for Search and Rescue Applications.

  • Technische Universität Ilmenau.

Ilmenau 04.11.2010.

(2010)

Beitrag in Sammelwerk/Tagungsband
  • Stefan Zorn
  • M. Maser
  • A. Goetz
  • R. Rose
  • R. Weigel

A power saving jamming system for E-GSM900 and DCS1800 cellular phone networks for search and rescue applications.

Piscataway, NJ: IEEE pg. 33-36

DOI: 10.1109/WISNET.2011.5725020

(2011)

Beitrag in Sammelwerk/Tagungsband
  • R. Rose
  • Stefan Zorn
  • A. Goetz
  • G. Fischer
  • R. Weigel

A new technique to improve AoA using dual polarization.

[London, UK]: Horizon House Publications pg. 420-423

(2011)

Beitrag in Sammelwerk/Tagungsband
  • A. Goetz
  • Stefan Zorn
  • R. Rose
  • G. Fischer
  • R. Weigel

A time difference of arrival system architecture for GSM mobile phone localization in search and rescue scenarios.

Piscataway, NJ: IEEE pg. 24-27

(2011)

Beitrag in Sammelwerk/Tagungsband
  • Stefan Zorn
  • R. Rose
  • A. Goetz
  • R. Weigel
  • A. Koelpin

A New System for Mobile Phone Localization for Search and Rescue Applications.

  • In:
  • J. Ender

Stuttgart: Fraunhofer Verlag

(2011)

Beitrag in Sammelwerk/Tagungsband
  • A. Goetz
  • R. Rose
  • Stefan Zorn
  • G. Fischer
  • R. Weigel

A Burst Phase Analysis Technique for High Precision Time Delay Estimation of Frequency Hopping GSM Signals.

Piscataway, NJ: IEEE pg. 1446-1449

(2011)

Beitrag in Sammelwerk/Tagungsband
  • A. Goetz
  • R. Rose
  • Stefan Zorn
  • G. Fischer
  • R. Weigel

A wideband crosscorrelation technique for high precision time delay estimation of frequency hopping GSM signals.

[London, UK]: Horizon House Publications pg. 33-36

(2011)

Beitrag in Sammelwerk/Tagungsband
  • M. Gardill
  • Stefan Zorn
  • R. Weigel
  • A. Koelpin

Triggering UMTS user equipment inter-RAT cell reselection using noise jammers.

Piscataway, NJ: IEEE pg. 1-4

(2011)

Beitrag in Sammelwerk/Tagungsband
  • Stefan Zorn
  • G. Bozsik
  • R. Rose
  • A. Goetz
  • R. Weigel
  • A. Koelpin

A power sensor unit for the localization of GSM mobile phones for search and rescue applications.

[Piscataway, N.J.]: IEEE pg. 1301-1304

DOI: 10.1109/ICSENS.2011.6127162

(2011)

Beitrag in Sammelwerk/Tagungsband
  • R. Rose
  • C. Meier
  • Stefan Zorn
  • A. Goetz
  • R. Weigel

A GSM-network for mobile phone localization in disaster scenarios.

Piscataway, NJ: IEEE pg. 1-4

(2011)

Vortrag
  • M. Gardill
  • Stefan Zorn
  • R. Weigel
  • A. Koelpin

Influencing Cell Reselection of UMTS User Equipment Using Interference Injection. Workshop.

Hamburg April 2011.

(2011)

Vortrag
  • A. Goetz
  • Stefan Zorn
  • R. Rose
  • G. Fischer
  • R. Weigel

A Time Difference of Arrival System Architecture for GSM Mobile Phone Localization in Search and Rescue Scenarios.

Dresden 07.-08.04.2011.

(2011)

Vortrag
  • A. Goetz
  • Stefan Zorn
  • R. Rose
  • G. Fischer
  • R. Weigel

Ortung von GSM Mobiltelefonen zur Vermissten- und Verschüttetensuche.

Ulm 25./26.05.2011.

(2011)

Vortrag
  • A. Goetz
  • R. Rose
  • Stefan Zorn
  • G. Fischer
  • R. Weigel

Algorithms for High Resolution Time Difference of Arrival Estimation for GSM Mobile Phones.

Miltenberg 26.-28.09.2011.

(2011)

Beitrag in Sammelwerk/Tagungsband
  • Stefan Zorn
  • M. Gardill
  • R. Rose
  • A. Goetz
  • R. Weigel
  • A. Koelpin

A smart jamming system for UMTS/WCDMA cellular phone networks for search and rescue applications.

Piscataway, NJ: IEEE pg. 1-3

DOI: 10.1109/MWSYM.2012.6257769

(2012)

Beitrag in Sammelwerk/Tagungsband
  • A. Goetz
  • R. Rose
  • Stefan Zorn
  • G. Fischer
  • R. Weigel

Performance of Coherent Time Delay Estimation Techniques for Frequency Hopping GSM Signals.

Piscataway, NJ: IEEE pg. 25-28

(2012)

Vortrag
  • Stefan Zorn

High Frequency PCB Design up to 67 GHz. Workshop.

Nürnberg 06.-11.10.2013.

(2013)

Beitrag in Sammelwerk/Tagungsband
  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • D. Hageneder
  • Stefan Zorn

Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages.

  • An effort to design an all-purpose RF chip package.

    • pg. 1465-1468

    (2016)

    Beitrag in Sammelwerk/Tagungsband
    • Franz Xaver Röhrl
    • Johannes Jakob
    • Werner Bogner
    • D. Hageneder
    • Stefan Zorn

    Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages.

  • An effort to design an all-purpose RF chip package.

    • pg. 536-539

    (2016)

    Beitrag in Sammelwerk/Tagungsband
    • Franz Xaver Röhrl
    • Roman Sammer
    • Johannes Jakob
    • Werner Bogner
    • R. Weigel
    • U. Hassel
    • Stefan Zorn

    Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications.

    DOI: 10.23919/EuMC.2017.8230878

    (2017)

    Bericht/Report
    • Franz Xaver Röhrl
    • Siegfried Hildebrand
    • Johannes Jakob
    • Stefan Zorn
    • Werner Bogner

    Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz). Projektbericht. Technische Hochschule Deggendorf/Technologie Campus Teisnach.

    (2017)

    Beitrag in Sammelwerk/Tagungsband
    • Franz Xaver Röhrl
    • Johannes Jakob
    • Werner Bogner
    • R. Weigel
    • Stefan Zorn

    Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications.

    (2018)

    Beitrag in Sammelwerk/Tagungsband
    • Felix Sepaintner
    • Andreas Scharl
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air.

    DOI: 10.1109/IMWS-AMP.2019.8880079

    (2019)

    Beitrag in Sammelwerk/Tagungsband
    • Johannes Jakob
    • R. Sammer
    • Franz Xaver Röhrl
    • Stefan Zorn
    • Werner Bogner

    WR12 to planar transmission line transition on organic substrate.

    DOI: 10.23919/EuMC.2019.8910843

    (2019)

    Zeitschriftenartikel
    • Franz Xaver Röhrl
    • Johannes Jakob
    • Werner Bogner
    • R. Weigel
    • Stefan Zorn

    Bare die connections via aerosol jet technology for millimeter wave applications.

    In: International Journal of Microwave and Wireless Technologies (vol. 11) , pg. 441-446

    (2019)

    DOI: 10.1017/S1759078719000114

    Abstract anzeigen

    This paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.
    Bericht/Report
    • Franz Xaver Röhrl
    • Siegfried Hildebrand
    • Johannes Jakob
    • Stefan Zorn
    • Werner Bogner

    Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz). Abschlussbericht. Technische Hochschule Deggendorf (THD)/Technologie Campus Teisnach.

    (2019)

    Vortrag
    • Felix Sepaintner
    • Andreas Scharl
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air. Invited Talk.

    Bochum 16.-18.07.2019.

    (2019)

    Vortrag
    • Johannes Jakob
    • R. Sammer
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    WR12 to planar transmission line transition on organic substrate. Invited Talk.

    Paris, Frankreich 29.09.-04.10.2019.

    (2019)

    Zeitschriftenartikel
    • Felix Sepaintner
    • Andreas Scharl
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    Characterization and Production of PCB Structures With Increased Ratio of Electromagnetic Field in Air.

    In: IEEE Transactions on Microwave Theory and Techniques (vol. 68) , pg. 2134-2143

    (2020)

    DOI: 10.1109/TMTT.2020.2983934

    Abstract anzeigen

    Producing passive printed circuit board (PCB) structures in the millimeter-wave range includes some fundamental challenges, such as low manufacturing costs and high fabrication accuracy. These aspects, in general, have to be combined with low signal attenuation, precise simulation models, and a reliable producibility. This article shows a new method to manufacture different kinds of passive RF waveguides with reduced attenuation and decreased electrical length on low-cost PCB substrates. First, the complex material parameters of the used substrate and the used copper foil are extracted from 10 to 100 GHz to have accurate simulation models in CST Microwave Studio. This is necessary because the parameters provided by the manufacturer are often no longer generally valid in this frequency range. In addition, PCB materials have a significantly higher surface roughness compared with conventional materials for millimeter-wave applications. Therefore, the correct determination and the correct modeling of surface roughness is particularly important. Next, laminate is removed partially on the outer layer of the PCB to increase the electromagnetic field ratio in air. The undesired substrate is removed by a CO2 laser drilling machine by setting narrow drills sequentially. The RF performance of these waveguides is compared with those manufactured in conventional PCB technology according to attenuation and producibility.
    Beitrag in Sammelwerk/Tagungsband
    • Felix Sepaintner
    • Andreas Scharl
    • Florian Keck
    • Kevin Kunze
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards.

    • In:
    • Institute of Electrical and Electronics Engineers Inc.
    • [Invited Talk].

    DOI: 10.1109/EPEPS48591.2020.9231382

    (2020)

    Beitrag in Sammelwerk/Tagungsband
    • Andreas Scharl
    • Felix Sepaintner
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz.

    • In:
    • Institute of Electrical and Electronics Engineers Inc.
    • [Invited Talk].

    (2020)

    Beitrag in Sammelwerk/Tagungsband
    • Felix Sepaintner
    • Andreas Scharl
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz.

    • In:
    • Institute of Electrical and Electronics Engineers Inc.
    • [Invited Talk].

    DOI: 10.1109/IMWS-AMP49156.2020.9199738

    (2020)

    Beitrag in Sammelwerk/Tagungsband
    • Andreas Scharl
    • Felix Sepaintner
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    Design and Comparison of Filter Structures in the Millimetre Wave Frequency Range on Outer- and Inner-Layers of Organic Circuits Boards.

    • In:
    • Institute of Electrical and Electronics Engineers Inc.
    • [Invited Talk].

    (2020)

    Zeitschriftenartikel
    • E. Hassan
    • B. Scheiner
    • F. Michler
    • M. Berggren
    • E. Wadbro
    • Franz Xaver Röhrl
    • Stefan Zorn
    • R. Weigel
    • F. Lurz

    Multi-Layer Topology Optimization of Wideband SIW-to-Waveguide Transitions.

    In: IEEE Transactions on Microwave Theory and Techniques (vol. 68) , pg. 1326-1339

    (2020)

    DOI: 10.1109/TMTT.2019.2959759

    Abstract anzeigen

    This article utilizes a topology optimization approach to design planar multilayer transitions between substrate integrated waveguides (SIWs) and rectangular waveguides (RWGs). The optimization problem is formulated based on the modal field analyses and Maxwell's equations in the time domain solved by the finite-difference time-domain (FDTD) method. We present a time-domain boundary condition based on the Klein-Gordon equation to split traveling waves at homogeneous waveguide ports. We employ the boundary condition to compute portal quantities and to devise an adjoint-field system that enabled an efficient computation of the objective function gradient. We solve design problems that include more than 105 000 design variables by using less than 400 solutions of Maxwell's equations. Moreover, a new formulation that effectively combats the development of in-band resonances in the design is presented. The transition configuration allows the direct mount of conventional RWG sections on the circuit board and aims to cover the entire K-band. The guiding structure of the optimized transition requires blind vias, which is realized by a simple and cost-efficient technique. In addition, the transition is optimized for three different setups that can be used to provide different field polarizations. The proposed transitions show less than 1-dB insertion loss and around 15-dB return loss over the frequency interval 18-28 GHz. Several prototypes are fabricated with an excellent match between the simulation and measurement results.
    Vortrag
    • Andreas Scharl
    • Felix Sepaintner
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz. Invited Talk.

    Cottbus 09.03.2020.

    (2020)

    Vortrag
    • Felix Sepaintner
    • Andreas Scharl
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz. Invited Talk.

    • Institute of Electrical and Electronics Engineers Inc..

    Suzhou, China 29.07.2020.

    (2020)

    Vortrag
    • Andreas Scharl
    • Felix Sepaintner
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    Design and Comparison of Filter Structures in the Millimetre Wave Frequency Range on Outer- and Inner-Layers of Organic Circuits Boards.

    • Institute of Electrical and Electronics Engineers Inc..

    Utrecht, The Netherlands 15.09.2020.

    (2020)

    Vortrag
    • Felix Sepaintner
    • Andreas Scharl
    • Florian Keck
    • Kevin Kunze
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards. Invited Talk.

    • Institute of Electrical and Electronics Engineers Inc..

    San José, CA, USA 05.10.2020.

    (2020)

    Beitrag in Sammelwerk/Tagungsband
    • Felix Sepaintner
    • M. Schmalzbauer
    • Johannes Jakob
    • Andreas Scharl
    • G. Weber
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    Comparison of an Inkjet Fabrication Method on Low-Cost PCB Substrates With Semi Additive And Subtractive Technologies Regarding RF-Performance.

    • In:
    • Institute of Electrical and Electronics Engineers Inc.

    IEEE pg. 266-268

    DOI: 10.1109/IMWS-AMP53428.2021.9643887

    (2021)

    Beitrag in Sammelwerk/Tagungsband
    • M. Schmalzbauer
    • Johannes Jakob
    • Andreas Scharl
    • Felix Sepaintner
    • K. Löbbicke
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    Reliability Investigations of Additive Manufactured RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology.

    • In:
    • Institute of Electrical and Electronics Engineers Inc.

    DOI: 10.23919/EuMC50147.2022.9784224

    (2021)

    Beitrag in Sammelwerk/Tagungsband
    • Andreas Scharl
    • Felix Sepaintner
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    A Cost-Effective Method for Extracting the Complex Permittivity of Inner Layer Dielectric PCB Materials.

    • In:
    • Institute of Electrical and Electronics Engineers Inc.

    DOI: 10.23919/EuMC50147.2022.9784297

    (2021)

    Zeitschriftenartikel
    • Felix Sepaintner
    • M. Schmalzbauer
    • K. Lobbicke
    • Johannes Jakob
    • Andreas Scharl
    • Franz Xaver Röhrl
    • Roman Sammer
    • Werner Bogner
    • Stefan Zorn

    Characterization of Additively Produced RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology for Industrial Applications up to 80 GHz.

    In: IEEE Transactions on Components, Packaging and Manufacturing Technology (vol. 11) , pg. 1-11

    (2021)

    DOI: 10.1109/TCPMT.2021.3118720

    Abstract anzeigen

    Usually, the printed circuit board industry has to use special subtractive manufacturing methods, if small line and space dimensions down to 50 μm are desired. This drastically raises production effort and costs. In this paper a method is shown, how the inkjet technology can be used to produce passive RF structures with minimum line and space dimensions of 25 μm. For the first time, this is possible over complete panels of low-cost PCB substrates, which have a relatively high surface roughness compared to ceramic or glass carriers. To ensure process reliability, printed lines must also be plated with an additional electroless copper layer to overcome the surface roughness with conductive layers and to lower insertion loss in the two-digit GHz range. Additionally, a surface impedance model is developed, which allows broadband first time right simulations. Finally, additively produced, passive RF filters are compared to their subtractive counterparts to show their benefits regarding production costs and electrical performance up to 80 GHz.
    Zeitschriftenartikel
    • M. Hrobak
    • K. Thurn
    • J. Moll
    • M. Hossain
    • A. Shrestha
    • T. Al-Sawaf
    • D. Stoppel
    • N. Weimann
    • A. Rämer
    • W. Heinrich
    • J. Martinez
    • M. Vossiek
    • T. Johansen
    • V. Krozer
    • M. Resch
    • J. Bosse
    • M. Sterns
    • K. Loebbicke
    • Stefan Zorn
    • M. Eissa
    • M. Lisker
    • F. Herzel
    • R. Miesen
    • K. Vollmann

    A Modular MIMO Millimeter-Wave Imaging Radar System for Space Applications and Its Components.

    In: Journal of Infrared, Millimeter, and Terahertz Waves (vol. 42) , pg. 275-324

    (2021)

    DOI: 10.1007/s10762-020-00736-9

    Abstract anzeigen

    This article presents the design and prototyping of components for a modular multiple-input-multiple-output (MIMO) millimeter-wave radar for space applications. A single radar panel consists of 8 transmitters (TX) and 8 receivers (RX), which can be placed several times on the satellite to realize application-specific radar apertures and hence different cross-range resolutions. The radar chirp signals are generated by SiGe:C BiCMOS direct-digital-synthesizers (DDS) in the frequency range of 1 to 10.5GHz with a chirp repetition rate of < 1μs within each TX and RX. The latter allows for easy interfaces in the MHz range in between the TX/RX units and therefore optimized 2-D sparse antenna arrays with rather large distances in between the TX/RX antennas. Furthermore, this allows for ideally linear frequency modulated continuous-waveforms (FMCW) in conjunction with phase-shift-keying (PSK) radar signals and enables simultaneous operation of all TX when code division multiplex (CDMA) modulation schemes are applied. Comparably low complexity of the TX/RX units has been achieved by applying straightforward frequency plans to signal generation and detection but comes with challenging requirements for the individual active and passive components. Tackled by thin film technology on alumina and the recently developed SiGe and InP semiconductor technologies, which have been further optimized in terms of process maturity and space qualification. Upconversion and downconversion to and from 85 to 94.5GHz are performed by double balanced Gilbert mixers realized with InP double heterojunction bipolar transistor technology (DHBT) and 42-GHz local oscillator signals from SiGe:C BiCMOS VCO synthesizer using phase-locked-loops (PLL). InP DHBT power amplifiers and low-noise amplifiers allow for output power levels of 15dBm and > 30dB gain with noise figure values of 9dB, respectively. The MIMO radar utilizes patch antenna arrays on organic multilayer printed circuit boards (PCB) with 18dBi gain and 18∘ half power beamwidth (HPBW). Generation of power supply and control signals, analog-to-digital conversion (ADC), and radar signal processing are provided centrally to each panel. The radar supports detection and tracking of satellites in distances up to 1000m and image generation up to 20m, which is required to support orbital maneuvers like satellite rendezvous and docking for non-cooperative satellites.
    Beitrag in Sammelwerk/Tagungsband
    • Felix Sepaintner
    • Andreas Scharl
    • Johannes Jakob
    • M. Schmalzbauer
    • Franz Xaver Röhrl
    • Werner Bogner
    • Stefan Zorn

    An Effective Surface Impedance Concept to Model Arbitrary Roughness Profiles on Printed Circuit Boards up to 110 GHz.

    pg. 783-786

    DOI: 10.1109/LMWT.2023.3268122

    (2023)

    Beitrag in Sammelwerk/Tagungsband
    • Felix Sepaintner
    • Andreas Scharl
    • Johannes Jakob
    • Franz Röhrl
    • Werner Bogner
    • Stefan Zorn

    A Robust And Cost-Effective Process Control Monitor Concept to Verify Quality Characteristics of Printed Circuit Boards up to 40 GHz.

    IEEE pg. 253-256

    DOI: 10.23919/GeMiC59120.2024.10485324

    (2024)

    Beitrag in Sammelwerk/Tagungsband
    • Felix Sepaintner
    • Andreas Scharl
    • Johannes Jakob
    • Franz Roehrl
    • Werner Bogner
    • Stefan Zorn

    A Modified Gradient Model to Determine Surface Impedance from Measured Roughness Profiles with Printed Circuit Board Emphasis.

    IEEE pg. 563-566

    DOI: 10.1109/IMS40175.2024.10600385

    (2024)