"This site requires JavaScript to work correctly"

Prof. Dr.-Ing. Werner Bogner

  • Analoge Schaltungstechnik
  • Hochfrequenzelektronik

Professor

Studiengangsleiter Master Elektrotechnik und Informationstechnik sowie Master Applied Research in Engineering Sciences

E 229

0991/3615-523

0991/3615-297


Sortierung:
Zeitschriftenartikel

  • Felix Sepaintner
  • M. Schmalzbauer
  • K. Lobbicke
  • Johannes Jakob
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Roman Sammer
  • Werner Bogner
  • Stefan Zorn

Characterization of Additively Produced RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology for Industrial Applications up to 80 GHz

In: IEEE Transactions on Components, Packaging and Manufacturing Technology vol. 11 pg. 1-11.

  • (2021)

DOI: 10.1109/TCPMT.2021.3118720

Usually, the printed circuit board industry has to use special subtractive manufacturing methods, if small line and space dimensions down to 50 μm are desired. This drastically raises production effort and costs. In this paper a method is shown, how the inkjet technology can be used to produce passive RF structures with minimum line and space dimensions of 25 μm. For the first time, this is possible over complete panels of low-cost PCB substrates, which have a relatively high surface roughness compared to ceramic or glass carriers. To ensure process reliability, printed lines must also be plated with an additional electroless copper layer to overcome the surface roughness with conductive layers and to lower insertion loss in the two-digit GHz range. Additionally, a surface impedance model is developed, which allows broadband first time right simulations. Finally, additively produced, passive RF filters are compared to their subtractive counterparts to show their benefits regarding production costs and electrical performance up to 80 GHz.
  • TC Teisnach Optik
  • Elektrotechnik und Medientechnik
  • DIGITAL
Zeitschriftenartikel

  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • R. Weigel
  • Stefan Zorn

Bare die connections via aerosol jet technology for millimeter wave applications

In: International Journal of Microwave and Wireless Technologies vol. 11 pg. 441-446.

  • (2019)

DOI: 10.1017/S1759078719000114

This paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.
  • TC Teisnach Optik
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • DIGITAL

Labore

Schaltungstechnik