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Prof. Dr.-Ing. Werner Bogner

  • Analoge Schaltungstechnik
  • Hochfrequenzelektronik

Fakultät Elektrotechnik und Medientechnik

Professor:innen

Professor

Studiengangsleiter Master Elektrotechnik und Informationstechnik sowie Master Applied Research in Engineering Sciences

E 229

0991/3615-523

0991/3615-297

Sortierung:
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • M. Schmalzbauer
  • T. Wagner
  • Johannes Jakob
  • Andreas Scharl
  • A. Kasbauer
  • Raimund Förg
  • Werner Bogner
  • Stefan Zorn

Analysis of Inkjet-Printed Interdigital Capacitors on Low-Cost PCB Substrates up to 40 GHz Compared to Other Estabilished Manufacturing Technologies . [Accepted for publication]

  • (2023)
  • TC Teisnach Sensorik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • Andreas Scharl
  • Johannes Jakob
  • M. Schmalzbauer
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

An Effective Surface Impedance Concept to Model Arbitrary Roughness Profiles on Printed Circuit Boards up to 110 GHz . [Accepted for publication]

  • (2023)
  • TC Teisnach Sensorik
  • DIGITAL
Zeitschriftenartikel

  • Felix Sepaintner
  • M. Schmalzbauer
  • K. Lobbicke
  • Johannes Jakob
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Roman Sammer
  • Werner Bogner
  • Stefan Zorn

Characterization of Additively Produced RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology for Industrial Applications up to 80 GHz

In: IEEE Transactions on Components, Packaging and Manufacturing Technology vol. 11 pg. 1-11.

  • (2021)

DOI: 10.1109/TCPMT.2021.3118720

Usually, the printed circuit board industry has to use special subtractive manufacturing methods, if small line and space dimensions down to 50 μm are desired. This drastically raises production effort and costs. In this paper a method is shown, how the inkjet technology can be used to produce passive RF structures with minimum line and space dimensions of 25 μm. For the first time, this is possible over complete panels of low-cost PCB substrates, which have a relatively high surface roughness compared to ceramic or glass carriers. To ensure process reliability, printed lines must also be plated with an additional electroless copper layer to overcome the surface roughness with conductive layers and to lower insertion loss in the two-digit GHz range. Additionally, a surface impedance model is developed, which allows broadband first time right simulations. Finally, additively produced, passive RF filters are compared to their subtractive counterparts to show their benefits regarding production costs and electrical performance up to 80 GHz.
  • TC Teisnach Optik
  • Elektrotechnik und Medientechnik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • M. Schmalzbauer
  • Johannes Jakob
  • Andreas Scharl
  • Felix Sepaintner
  • K. Löbbicke
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Reliability Investigations of Additive Manufactured RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology

  • (2021)

DOI: 10.23919/EuMC50147.2022.9784224

In this paper a reliability study of additively manufactured RF structures on printed circuit boards (PCB) based on inkjet technology is presented. First, the main focus is placed on the development of a suitable PCB test layout which contains microstrip lines, RF filters and ball grid array (BGA) structures. In order to ensure a good comparability with the standard subtractive technology, additive and standard manufactured structures are placed side by side. During our analysis both thermal and mechanical reliability tests were conducted. Possible changes in electrical properties were determined by subsequent RF measurements at multiple readouts. To our knowledge, for the first time an equivalent RF performance of additive and subtractive manufactured structures after stress tests up to 40 GHz was observed. Additionally, the compatibility of the additively manufactured structures with standard assembly processes are examined. Therefore, bond and solder tests are performed. Finally, an extensive assessment of all robustness tests is carried out and a recommendation about a future applicability in series products is given.
  • TC Teisnach Optik
  • Elektrotechnik und Medientechnik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • M. Schmalzbauer
  • Johannes Jakob
  • Andreas Scharl
  • G. Weber
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Comparison of an Inkjet Fabrication Method on Low-Cost PCB Substrates With Semi Additive And Subtractive Technologies Regarding RF-Performance

pg. 266-268.

  • (2021)

DOI: 10.1109/IMWS-AMP53428.2021.9643887

  • TC Teisnach Optik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Andreas Scharl
  • Felix Sepaintner
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

A Cost-Effective Method for Extracting the Complex Permittivity of Inner Layer Dielectric PCB Materials

  • (2021)

DOI: 10.23919/EuMC50147.2022.9784297

This paper presents a new cost-effective method to deduce the dielectric properties of substrate materials, which are used in inner layers of low cost printed circuit boards (PCBs). Two different on board structures are applied to estimate the desired complex permittivity in two different ways. On the one hand, a T-resonator based on substrate integrated waveguide technology (SIW) is used, on the other hand a stripline, whereby both are a combination of the outer layer laminate and the underlying prepreg. At first, the scattering parameters of both dielectric structures are measured with a vector network analyzer (VNA). The structures are then simulated with the finite integral method (FI) with all dielectric materials substituted by air. Afterwards, a second simulation with the dielectric constant (DK) of the known dielectric material is necessary. Next, the real part of the complex permittivity is calculated. Finally, the dissipation factor (DF) is calculated.
  • Elektrotechnik und Medientechnik
  • TC Teisnach Optik
  • DIGITAL
Zeitschriftenartikel

  • Michael Benisch
  • Johannes Liebl
  • Werner Bogner
  • O. Fähnle
  • E. Rädlein

Impact analysis of temperature and humidity effects on polishing

In: EPJ Web of Conferences vol. 255 pg. 03011.

  • (2021)

DOI: 10.1051/epjconf/202125503011

The polishing process for optical glass is one with intertwined chemical and mechanical processes. The aim of the present study is to verify whether control of these factors can be used to improve the efficiency of the polishing process.
  • TC Teisnach Optik
  • NACHHALTIG
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Andreas Scharl
  • Felix Sepaintner
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Design and Comparison of Filter Structures in the Millimetre Wave Frequency Range on Outer- and Inner-Layers of Organic Circuits Boards . [Invited Talk]

  • (2020)
  • TC Teisnach Optik
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • Andreas Scharl
  • Florian Keck
  • Kevin Kunze
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards . [Invited Talk]

  • (2020)

DOI: 10.1109/EPEPS48591.2020.9231382

This paper presents a new cost-effective method to produce air-filled waveguides out of a printed circuit board (PCB) with a milling machine and how to implement them with standard PCB technology. For this purpose, low cost substrates like FR-4 are used. For the baseboard to waveguide transition in the E-Band (60-90GHz) a WR12 waveguide connector [1] was used. The WR12 waveguide was manufactured and analyzed on mechanical deviations. The RF performance in the E-Band was measured and compared to common PCB waveguides like microstrip lines (MS) and grounded coplanar waveguides (GCPW).
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Michael Benisch
  • O. Fähnle
  • Rolf Rascher
  • Werner Bogner

Force and pressure analysis during overarm polishing

pg. 114780H.

Bellingham, WA, USA

  • (2020)

DOI: 10.1117/12.2564903

The Preston-equation implies, that, besides the relative speed υrel and a specific constant KP, the pressure p plays a significant role for the removal rate when polishing an optical component. This paper demonstrates a possibility for a qualitative evaluation of the pressure distribution before the polishing process. A pressure-sensitive foil is used as a gauge for pressure measurement. The effectiveness of this measuring method is explained. Specific weaknesses and limitations in the use of these foils are discussed. A method for an integrated evaluation of the pressure on different spots of the polishing pad is proposed at the end of the paper.
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • NACHHALTIG
Beitrag in Sammelwerk/Tagungsband

  • Andreas Scharl
  • Felix Sepaintner
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz . [Invited Talk]

  • (2020)

In this paper, 4 different crossover structures in a 6-layered printed circuit board (PCB) for high operation frequencies are presented. The design for all structures is based on grounded coplanar waveguide (GCPW). Two fully planar structures, a quasi-coaxial transition and coaxial transition are realized and have a measured bandwidth from DC to 50 GHz and DC to 60 GHz, respectively. Moreover, two structures are designed in submount technology. Especially the connection between baseboard and package (solder junction) plays an important role to guarantee best signal integrity. Therefore, the quality of the solder junction is analysed in detail with TDR (time domain reflectometry) measurement as well as with X-ray images. The submount transitions show good radio frequency (RF) characteristics from DC to 70 GHz.
  • TC Teisnach Optik
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • DIGITAL
Vortrag

  • Andreas Scharl
  • Felix Sepaintner
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz . Invited Talk

In: 2020 German Microwave Conference (GeMiC)

Cottbus

  • 09.03.2020 (2020)
  • TC Teisnach Optik
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • NACHHALTIG
  • DIGITAL
Vortrag

  • Andreas Scharl
  • Felix Sepaintner
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Design and Comparison of Filter Structures in the Millimetre Wave Frequency Range on Outer- and Inner-Layers of Organic Circuits Boards

In: 2020 50th European Microwave Conference (EuMC)

Institute of Electrical and Electronics Engineers Inc. Utrecht, The Netherlands

  • 15.09.2020 (2020)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
  • NACHHALTIG
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz . [Invited Talk]

  • (2020)

DOI: 10.1109/IMWS-AMP49156.2020.9199738

This paper presents a new numerical method to deduce the complex permittivity εr of PCB (printed circuit board) substrates. First, the attenuation and phase of an on board transmission line are measured with a vector network analyzer (VNA). The transmission line is then simulated with the finite difference integral method (FDI) with the substrate substituted by air. The measured and simulated phases are used, to calculate the effective permittivity and the real part of the complex permittivity εr ' . With known εr ' , the electromagnetic field distribution can be calculated, which is necessary to deduce the imaginary part of the permittivity. The shown algorithms can be used for frequencies up to 100 GHz and without any iterative processes.
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Vortrag

  • Felix Sepaintner
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz . Invited Talk

In: 2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

Institute of Electrical and Electronics Engineers Inc. Suzhou, China

  • 29.07.2020 (2020)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • NACHHALTIG
  • DIGITAL
Zeitschriftenartikel

  • Felix Sepaintner
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Characterization and Production of PCB Structures With Increased Ratio of Electromagnetic Field in Air

In: IEEE Transactions on Microwave Theory and Techniques vol. 68 pg. 2134-2143.

  • (2020)

DOI: 10.1109/TMTT.2020.2983934

Producing passive printed circuit board (PCB) structures in the millimeter-wave range includes some fundamental challenges, such as low manufacturing costs and high fabrication accuracy. These aspects, in general, have to be combined with low signal attenuation, precise simulation models, and a reliable producibility. This article shows a new method to manufacture different kinds of passive RF waveguides with reduced attenuation and decreased electrical length on low-cost PCB substrates. First, the complex material parameters of the used substrate and the used copper foil are extracted from 10 to 100 GHz to have accurate simulation models in CST Microwave Studio. This is necessary because the parameters provided by the manufacturer are often no longer generally valid in this frequency range. In addition, PCB materials have a significantly higher surface roughness compared with conventional materials for millimeter-wave applications. Therefore, the correct determination and the correct modeling of surface roughness is particularly important. Next, laminate is removed partially on the outer layer of the PCB to increase the electromagnetic field ratio in air. The undesired substrate is removed by a CO2 laser drilling machine by setting narrow drills sequentially. The RF performance of these waveguides is compared with those manufactured in conventional PCB technology according to attenuation and producibility.
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Vortrag

  • Felix Sepaintner
  • Andreas Scharl
  • Florian Keck
  • Kevin Kunze
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards . Invited Talk

In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Institute of Electrical and Electronics Engineers Inc. San José, CA, USA

  • 05.10.2020 (2020)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
  • NACHHALTIG
Vortrag

  • Felix Sepaintner
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air . Invited Talk

In: IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes (IMWS-AMP)

Bochum

  • 16.-18.07.2019 (2019)
  • TC Teisnach Optik
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • DIGITAL
Zeitschriftenartikel

  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • R. Weigel
  • Stefan Zorn

Bare die connections via aerosol jet technology for millimeter wave applications

In: International Journal of Microwave and Wireless Technologies vol. 11 pg. 441-446.

  • (2019)

DOI: 10.1017/S1759078719000114

This paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.
  • TC Teisnach Optik
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • DIGITAL
Bericht/Report

  • Franz Xaver Röhrl
  • Siegfried Hildebrand
  • Johannes Jakob
  • Stefan Zorn
  • Werner Bogner

Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) . Abschlussbericht

Technische Hochschule Deggendorf (THD)/Technologie Campus Teisnach

  • 2019 (2019)
  • TC Teisnach Optik
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Johannes Jakob
  • R. Sammer
  • Franz Xaver Röhrl
  • Stefan Zorn
  • Werner Bogner

WR12 to planar transmission line transition on organic substrate

  • (2019)

DOI: 10.23919/EuMC.2019.8910843

Transitions for planar transmission lines on printed circuit boards to rectangular waveguide are challenging to design and manufacture. This paper introduces two transitions, the first one is a broadband transition from WR12 (60-90 GHz) waveguide to a stripline (SL) and the second is a narrowband transition to a grounded coplanar waveguide (GCPW). The focus at the first transition is based on the fact that signals can be transmitted in the complete E-Band. In the process, many manufacturing possibilities were exploited. For the second transition, the focus was on manufacturability in order to achieve the most cost effective transition possible. Design, simulated and measured results will be presented.
  • TC Teisnach Optik
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Michael Benisch
  • Werner Bogner
  • Rolf Rascher

Using A Digital Temperature Sensor To Measure The Temperature Development During A Polishing Process

  • (2019)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • NACHHALTIG
Beitrag in Sammelwerk/Tagungsband

  • Felix Sepaintner
  • Andreas Scharl
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air

  • (2019)

DOI: 10.1109/IMWS-AMP.2019.8880079

This paper presents a new method to produce different kinds of RF waveguides with reduced attenuation on low cost PCB substrates. First, microstrip (MS) and grounded coplanar waveguides (GCPW) are characterized by considering rough conductors in CST Microwave Studio. Next, laminate is partially removed, to increase the electromagnetic field ratio in air. Accordingly, the dielectric losses are reduced and the electrical length is decreased. These conductors are produced by using a CO 2 laserdrilling machine to remove the undesired substrate. The RF performance (DC to 100 GHz) of these waveguides is compared to transmission lines manufactured in conventional PCB technology. Finally, different kinds of simulated and produced microstrip filters are shown and fabrication tolerances are compared to those produced in standard technology.
  • TC Teisnach Optik
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • DIGITAL
Vortrag

  • Johannes Jakob
  • R. Sammer
  • Franz Xaver Röhrl
  • Werner Bogner
  • Stefan Zorn

WR12 to planar transmission line transition on organic substrate . Invited Talk

In: 49th European Microwave Conference (EuMC)

Paris, Frankreich

  • 29.09.-04.10.2019 (2019)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • R. Weigel
  • Stefan Zorn

Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications

  • (2018)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Bericht/Report

  • Franz Xaver Röhrl
  • Siegfried Hildebrand
  • Johannes Jakob
  • Stefan Zorn
  • Werner Bogner

Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz) . Projektbericht

Technische Hochschule Deggendorf/Technologie Campus Teisnach

  • 2017 (2017)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • TC Teisnach Optik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Franz Xaver Röhrl
  • Roman Sammer
  • Johannes Jakob
  • Werner Bogner
  • R. Weigel
  • U. Hassel
  • Stefan Zorn

Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications

  • (2017)

DOI: 10.23919/EuMC.2017.8230878

  • TC Teisnach Optik
  • Elektrotechnik und Medientechnik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • D. Hageneder
  • Stefan Zorn

Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages . An effort to design an all-purpose RF chip package

pg. 1465-1468.

  • (2016)
  • TC Teisnach Optik
  • Elektrotechnik und Medientechnik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • D. Hageneder
  • Stefan Zorn

Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages . An effort to design an all-purpose RF chip package

pg. 536-539.

  • (2016)
  • TC Teisnach Optik
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • Franz Xaver Röhrl
  • Johannes Jakob
  • Werner Bogner
  • D. Hageneder

Wideband RF interconnects for organic chip packages comparison of single ended and differential transitions . An effort to design an all-purpose RF chip package

pg. 781-784.

  • (2015)
  • Angewandte Naturwissenschaften und Wirtschaftsingenieurwesen
  • DIGITAL
Beitrag in Sammelwerk/Tagungsband

  • A. Bauer
  • Johannes Jakob
  • R. Gmiha
  • D. Hageneder
  • Werner Bogner

Embedded Resistors for High Frequency Applications on Printed Circuit Boards

  • (2013)
  • Elektrotechnik und Medientechnik
Vortrag

  • Werner Bogner
  • et al.

40Gbit/s SiGe bipolar chipset for terabit optical networks

In: EE Seminar on High Performance Semiconductor Devices and Circuits for Communication

London, Großbritannien

  • 04.12.2000 (2000)
  • Elektrotechnik und Medientechnik
Patentschrift

  • D. Stoll
  • Werner Bogner

Verfahren zum drahtlosen Übermitteln von nach einer Breitband-Übertragungstechnologie konzipierten Breitband-orientierten Datenströmen

  • (1999)
  • Elektrotechnik und Medientechnik
Vortrag

  • T. Kerssenbrock
  • H. Tischer
  • R. Roskosch
  • Werner Bogner
  • et al.

W-Band sensor module in flip-chip technology

In: International IEEE MTT/AP Workshop on MMIC Design, Packaging and System Applications

Freiburg

  • 1998 (1998)
  • Elektrotechnik und Medientechnik
Beitrag in Sammelwerk/Tagungsband

  • T. Kerssenbrock
  • H. Tischer
  • H. Siweris
  • Werner Bogner
  • et al.

Flip-chip modules for millimeter-wave sensor applications

pg. 601-606.

  • (1998)
  • Elektrotechnik und Medientechnik
Vortrag

  • T. Kerssenbrock
  • Werner Bogner
  • et al.

Flip-chip modules for millimeter-wave sensor applications

In: Microwave MTT-S International Symposium

Baltimore, MD, USA

  • 07.-12.07.1998 (1998)
  • Elektrotechnik und Medientechnik
Patentschrift

  • Werner Bogner

Takt- und Datenregenerator für hohe Datenraten

  • (1998)
  • Elektrotechnik und Medientechnik
Vortrag

  • Werner Bogner
  • et al.

A low cost 77 GHz FMCW automotive radar module

In: Internationales Radar Symposium

München

  • 15.-17.09.1998 (1998)
  • Elektrotechnik und Medientechnik
Zeitschriftenartikel

  • J. Müllrich
  • T. Meister
  • M. Rest
  • Werner Bogner
  • et al.

40Gbit/s transimpedance amplifier in SiGe bipolar technology for the receiver in optical fibre TDM links

In: Electronics Letters vol. 34 pg. 452-453.

  • (1998)

DOI: 10.1049/el:19980268

A transimpedance amplifier for a 40 Gbit/s optical-fibre electrical TDM system has been realised in an advanced SiGe bipolar technology. Despite its high gain (transimpedance of 2 kΩ in the limiting mode) the complete amplifier of the receiver was put on a single chip. Clear output eye diagrams at a constant (limited) output voltage swing of 0.6 Vp-p were measured at 40 Gbit/s
  • Elektrotechnik und Medientechnik
Zeitschriftenartikel

  • D. Stoll
  • Werner Bogner

Mit 155 Mbit/s und ATM-Technik über Funkverbindung zum Teilnehmer

In: Nachrichtentechnische Zeitschrift (ntz) vol. 50 pg. 64-67.

  • (1997)
  • Elektrotechnik und Medientechnik
Zeitschriftenartikel

  • Werner Bogner
  • E. Gottwald
  • A. Schöpflin
  • C.-J. Weiske

40Gbit/s unrepeatered optical transmission over 148 km by electrical time division multiplexing and demultiplexing

In: Electronics Letters vol. 33 pg. 2136-2137.

  • (1997)

DOI: 10.1049/el:19971468

Using electrical time division multiplexing and demultiplexing, a transmission experiment at 40 Gbit/s, with NRZ signals over an unrepeatered link comprising 148 km of dispersion-shifted fibre, is demonstrated for the first time. A receiver sensitivity from –22.5 to –24.2 dBm was achieved.
  • Elektrotechnik und Medientechnik
Beitrag in Sammelwerk/Tagungsband

  • Werner Bogner
  • et al.

20 Gbit/s TDM nonrepeatered transmission over 198 km DSF using Si-bipolar IC for demultiplexing and clock recovery

  • (1996)
  • Elektrotechnik und Medientechnik
Zeitschriftenartikel

  • J. Freyer
  • W. Harth
  • Werner Bogner
  • M. Pöbl
  • M. Claassen

GaAs transit-time diodes for D-band frequencies

In: Electrical Engineering vol. 78 pg. 257-259.

  • (1995)
Tunneling assisted GaAs avalanche transit-time diodes with oscillation frequencies between 140 and 170 GHz are presented. The device design results in a relatively low dc-voltage of 8 Volts. A non-alloyed Schottky contact instead of an ohmic contact on highly doped GaAs reduces losses at rf-frequencies. Cw-output power of 10 mW at 142 GHz and 1.3 mW at 170 GHz are attained in fundamental mode with devices on diamond heat-sinks. The diodes show an excellent noise behaviour resulting in a noise measure of only 26.5 dB at 170 GHz.
  • Elektrotechnik und Medientechnik
Zeitschriftenartikel

  • M. Pöbl
  • Werner Bogner
  • L. Gaul

CW GaAs MITATT source on copper heatsink up to 160 GHz

In: Electronics Letters vol. 30 pg. 1316-1317.

  • (1994)
The performance of a GaAs pn-junction transit time device with mixed tunnel-avalanche breakdown is described. At 164 GHz a CW output power of 1 mW has been achieved in the fundamental mode with devices on copper heatsink. This is to date the highest frequency achieved with CW GaAs diodes. The corresponding noise measure is 28 dB at 160 GHz
  • Elektrotechnik und Medientechnik
Zeitschriftenartikel

  • Werner Bogner

Planare GaAs‑Oszillatoren für mm‑Wellen

In: Archiv für Elektrotechnik vol. 77 pg. 11-14.

  • (1994)

DOI: 10.1007/BF01574915

Integrierte Oszillatoren mit Lawinenlaufzeitdioden auf semiisolierendem GaAs-Substrat werden fr Frequenzen im Millimeterwellenbereich beschrieben. Die maximale Ausgangsleistung, die damit im W-Band, bei einer Frequenz von 87 GHz erreicht wird, betrgt im Dauerstrichbetrieb 10 mW. Ein integrierter Leistungsaddierer wird vorgestellt, der neben einer Erhhung der Ausgangsleistung integrierter Oszillatoren auch eine Reduzierung des Phasenrauschens ermglicht. Untersuchungen der Eigenschaften von Lawinenlaufzeitdioden als selbstmischende Oszillatoren fhren zum Einsatz dieser Bauelemente in integrierten aktiven Antennen fr Doppler-Radar-Anwendungen.Planar integrated Impatt-oscillators on semiinsulating GaAs-substrate for the mm-wave frequency range are described. In W-band, at a frequency of 87 GHz, a maximum cw output-power of 10 mW is achieved. A planar power-combiner circuit is developed, which allows an increase in output-power and reduces the phasenoise of the integrated oscillators. The investigation of the properties of Impatt-diodes as selfmixing oscillators is leading to an application of these devices in integrated active antennas for Doppler-radar.
  • Elektrotechnik und Medientechnik
Zeitschriftenartikel

  • W. Harth
  • Werner Bogner
  • L. Gaul
  • M. Claassen

A comparative study on the noise measure of millimetre‑wave GaAs IMPATT diodes

In: Solid-State Electronics vol. 37 pg. 427-431.

  • (1994)
It is theoretically and experimentally demonstrated that the small-signal noise measure of Gaas single-drift Impatt-diodes can efficiently be reduced by increasing the total width of the diode space-charge region due to shot-noise reduction and space-charge smoothing. For a total space-charge region width of 770 nm, a minimum noise-measure of 22 dB at 60 GHz is obtained. This value reaches almost the theoretical optimum noise measure of pin-avalanche diodes.
  • Elektrotechnik und Medientechnik
Vortrag

  • J. Freyer
  • T. Bauer
  • M. Tschernitz
  • M. Claassen
  • M. Pöbl
  • Werner Bogner

GaAs transit‑time device structures for power generation from 100 up to 200 GHz

In: International Seminar on Terahertz Electronics

Darmstadt

  • 28.-29.03.1994 (1994)
  • Elektrotechnik und Medientechnik
Beitrag in Sammelwerk/Tagungsband

  • Werner Bogner
  • et al.

Rauscharmer planarer Oszillator und Leistungsaddierer für mm‑Wellen‑Frequenzen

pg. 523-527.

  • (1993)
  • Elektrotechnik und Medientechnik
Beitrag in Sammelwerk/Tagungsband

  • Werner Bogner

Planare GaAs‑Oszillatoren für mm‑Wellen

  • (1993)
  • Elektrotechnik und Medientechnik
Zeitschriftenartikel

  • Werner Bogner
  • et al.

Monolithically integrated active millimetre‑wave circuits on semiinsulating GaAs

In: Archiv für Elektronik und Übertragungstechnik (AEÜ) vol. 47 pg. 52-57.

  • (1993)
  • Elektrotechnik und Medientechnik
Beitrag in Sammelwerk/Tagungsband

  • Werner Bogner
  • et al.

V‑band monolithic GaAs IMPATT‑oscillator

pg. 358-363.

  • (1991)
  • Elektrotechnik und Medientechnik
Vortrag

  • Werner Bogner
  • et al.

Millimeterwellenbauelemente und optoelektronische Bauelemente aus MBE‑Material

In: MBE Workshop 1991

KFA Jülich Jülich

  • 14.-15.03.1991 (1991)
  • Elektrotechnik und Medientechnik
Beitrag in Sammelwerk/Tagungsband

  • Werner Bogner
  • et al.

Planar oscillators for mm‑wave GaAs MMIC application

  • (1991)
  • Elektrotechnik und Medientechnik
Beitrag in Sammelwerk/Tagungsband

  • J. Freyer
  • Werner Bogner

MMIC‑resonators on SI‑GaAs for V‑band frequencies

pg. 43-50.

  • (1990)
  • Elektrotechnik und Medientechnik
Beitrag in Sammelwerk/Tagungsband

  • Werner Bogner
  • et al.

Characterization of rectangular microstrip resonators on semi-insulating GaAs for V‑band frequencies

  • (1990)
  • Elektrotechnik und Medientechnik
Beitrag in Sammelwerk/Tagungsband

  • Werner Bogner
  • et al.

70 GHz planar integrated oscillator on semi-insulating GaAs

pg. 593-598.

  • (1990)
  • Elektrotechnik und Medientechnik
Beitrag in Sammelwerk/Tagungsband

  • J. Freyer
  • Werner Bogner

V‑band rectangular microstrip line oscillator

  • (1990)
  • Elektrotechnik und Medientechnik
Zeitschriftenartikel

  • Werner Bogner
  • et al.

Microstrip power combiner/divider at 60 GHz on semi-insulating GaAs

In: Archiv für Elektronik und Übertragungstechnik (AEÜ) vol. 43 pg. 187-190.

  • (1989)
Design and fabrication of microstrip couplers on semiinsulating GaAs substrates for V-band frequencies are described. A tapered ridged waveguide transition was used for measurements. A 50 ohm ratrace coupler with a power split ratio of unity and an isolation of more than 25 dB was realized. The combining efficiency of the coupler is over 90 percent in the measurement bandwidth.
  • Elektrotechnik und Medientechnik
Beitrag in Sammelwerk/Tagungsband

  • J. Freyer
  • Werner Bogner

V‑band microstrip circuits for GaAs MMIC application

  • (1989)
  • Elektrotechnik und Medientechnik

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